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PRODUCT AND PROCESS CHANGE NOTIFICATION
Generic Copy

ISSUE DATE:20-Sep-2013
NOTIFICATION:15862
TITLE:TSMC 0.18UM CU & X-FLAG LEADFRAME CONV FOR KLM 112/144LQFP
EFFECTIVE DATE:19-Dec-2013

DEVICE(S)
MPN
MC9S12XEQ384CAG
MC9S12XEQ384CAL
MC9S12XEQ384MAG
MC9S12XEQ384MAL
MC9S12XEQ512CAG
MC9S12XEQ512CAGR
MC9S12XEQ512CAL
MC9S12XEQ512MAG
MC9S12XEQ512MAL
MC9S12XF512MLM
MC9S12XS128MAL
P912XEQ512F1MAG
P912XEQ512F1MAGR
P912XEQ512F1MAL
P912XEQ512F1MALR
P9S12XEQ512J1MAG
S912XEG384AVAG
S912XEG384AVAGR
S912XEG384BCAG
S912XEG384BCAGR
S912XEG384BCAL
S912XEG384BCALR
S912XEG384BVAL
S912XEG384BVALR
S912XEG384F0CAL
S912XEG384F0CALR
S912XEG384F0VAL
S912XEG384F1CAL
S912XEG384F1CALR
S912XEG384F1VAG
S912XEG384J2CAL
S912XEG384J2CALR
S912XEG384J2VAG
S912XEG384J2VAGR
S912XEG384J2VAL
S912XEG384J3CAG
S912XEG384J3CAGR
S912XEG384J3CAL
S912XEG384J3CALR
S912XEG384J3VAG
S912XEG384J3VAGR
S912XEG384J3VAL
S912XEG384J3VALR
S912XEQ384ACAL
S912XEQ384AMAL
S912XEQ384AMALR
S912XEQ384BCAG
S912XEQ384BCAGR
S912XEQ384BMAL
S912XEQ384BMALR
S912XEQ384BVAL
S912XEQ384BVALR
S912XEQ384F0CAL
S912XEQ384F0CALR
S912XEQ384F1CAG
S912XEQ384F1CAGR
S912XEQ384F1CAL
S912XEQ384F1CALR
S912XEQ384F1MAG
S912XEQ384F1MAGR
S912XEQ384F1MAL
S912XEQ384F1MALR
S912XEQ384F1VAG
S912XEQ384F1VAGR
S912XEQ384F1VAL
S912XEQ384F1VALR
S912XEQ384J2CAL
S912XEQ384J2MAG
S912XEQ384J2MAL
S912XEQ384J2MALR
S912XEQ384J3CAG
S912XEQ384J3CAGR
S912XEQ384J3CAL
S912XEQ384J3CALR
S912XEQ384J3MAG
S912XEQ384J3MAGR
S912XEQ384J3MAL
S912XEQ384J3MALR
S912XEQ384J3VAG
S912XEQ384J3VAGR
S912XEQ384J3VAL
S912XEQ384J3VALR
S912XEQ512ACAL
S912XEQ512ACALR
S912XEQ512AMAL
S912XEQ512AMALR
S912XEQ512AVAL
S912XEQ512BCAG
S912XEQ512BCAGR
S912XEQ512BCAL
S912XEQ512BMAL
S912XEQ512BMALR
S912XEQ512BVAG
S912XEQ512BVAGR
S912XEQ512BVAL
S912XEQ512BVALR
S912XEQ512F0CAL
S912XEQ512F0CALR
S912XEQ512F0MAG
S912XEQ512F0MAL
S912XEQ512F0MALR
S912XEQ512F0VAL
S912XEQ512F1MAG
S912XEQ512F1MAGR
S912XEQ512F1MAL
S912XEQ512F1MALR
S912XEQ512F1VAG
S912XEQ512F1VAGR
S912XEQ512F1VAL
S912XEQ512F1VALR
S912XEQ512J2CAG
S912XEQ512J2CAL
S912XEQ512J2CALR
S912XEQ512J2MAG
S912XEQ512J2MAL
S912XEQ512J2MALR
S912XEQ512J2VAG
S912XEQ512J2VAL
S912XEQ512J3CAG
S912XEQ512J3CAGR
S912XEQ512J3CAL
S912XEQ512J3CALR
S912XEQ512J3MAG
S912XEQ512J3MAGR
S912XEQ512J3MAL
S912XEQ512J3MALR
S912XEQ512J3VAG
S912XEQ512J3VAGR
S912XEQ512J3VAL
S912XEQ512J3VALR
S912XES384J3VAG
S912XES384J3VAGR
S912XES384J3VAL
S912XET512AVAG
S912XET512AVAGR
S912XET512BCAG
S912XET512BCAGR
S912XET512BMAG
S912XET512BMAGR
S912XET512BVAG
S912XET512BVAGR
S912XET512BVAL
S912XET512BVALR
S912XET512F1VAL
S912XET512F1VALR
S912XET512J2VAG
S912XET512J2VAGR
S912XET512J3CAL
S912XET512J3MAG
S912XET512J3MAGR
S912XET512J3VAG
S912XET512J3VAGR
S912XET512J3VAL
S912XET512J3VALR
S9S12XF256J1CLM
S9S12XF256J2VLM
S9S12XF384J2MLM
S9S12XF384J2MLMR
S9S12XF384J2VLM
S9S12XF512J2MLM
S9S12XF512J2VLM
S9S12XS128J1CAL
S9S12XS128J1CALR
S9S12XS128J1MAL
S9S12XS128J1MALR
S9S12XS128J1VAL
S9S12XS256J0CAL
S9S12XS256J0CALR
S9S12XS256J0MAL
S9S12XS256J0MALR
S9S12XS256J0VAL
S9S12XS256J0VALR
S9S12XS64J1MAL
SC667324VAL
SC667324VALR



AFFECTED CHANGE CATEGORIES
  • ASSEMBLY PROCESS

  • NEW PIECE PARTS AND/OR COMPONENT SUPPLIER


  • DESCRIPTION OF CHANGE

     

    Freescale Semiconductor announces the addition of Copper Wire as a wirebond material for the following product:

    1. S12XS256 for 112LQFP products currently assembled with Gold wire at Freescale KLM assembly site, Kuala Lumpur, Malaysia

    2. S12XS128/64 for 112LQFP products currently assembled with Gold wire at Freescale KLM assembly site, Kuala Lumpur, Malaysia

    3. S12XEx512/384 for 112LQFP products currently assembled with Gold wire at Freescale KLM assembly site, Kuala Lumpur, Malaysia

    4. S12XF512/384/256/128 for 112LQFP products currently assembled with Gold wire at Freescale KLM assembly site, Kuala Lumpur, Malaysia

    5. S12XEx512/384 for 144LQFP products currently assembled with Gold wire at Freescale KLM assembly site, Kuala Lumpur, Malaysia

    The Wire diameter for Gold Wire and Copper Wire will remain at 25um

    The change to Cu wire also includes a change in leadframe flag type. Products currently utilizing an X-Flag will convert to a Solid Flag.

    The part number of the mold compound will be updated per the table below. The new part number indicates a tightening of the mold compound specifications for use with Cu (Copper) wire.

    112/144LQFP Package

    Current Mold Compound
    MC Hitachi 9200HF10M
    Updated Mold Compound
    CEL-9200HF10M Cu Wire



    REASON FOR CHANGE

     

    The transfer from Gold to Copper wire is required to mitigate against raw material cost increases and to ensure supply assurance.

    This leadframe flag change enables a robust Cu wirebond process.



    ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

     

    Wire composition and leadframe flag type are the only change to form. No Impact to fit or function. Reliability is equivalent or improved.




    Freescale will consider specific conditions of acceptance of this change submitted within 30 days of receipt of this notice on a case by case basis. To request further data or inquire about the notification, please enter a Service Request.

    For sample inquiries - please go to www.freescale.com

    QUAL DATA AVAILABILITY DATE:     25-Oct-2013

    QUALIFICATION STATUS:     COMPLETED

    QUALIFICATION PLAN:

     

    See attached qualification results.



    RELIABILITY DATA SUMMARY:

     

    See attached qualification results.



    ELECTRICAL CHARACTERISTIC SUMMARY:

     

    No change was made to the operating performance of the device. No change to datasheet. Electrical Distribution Gold versus Copper wire comparison enclosed. 





    CHANGED PART IDENTIFICATION:

     

    There is no change to orderable part number. The Tracecode marking on the device includes assembly site and datecode. Freescale will have traceability by assembly site and datecode.



    SAMPLE AVAILABILITY DATE: 11-Sep-2013



    ATTACHMENT(S):
    External attachment(s) FOR this notification can be viewed AT:
    15862_0.18um_X_to_Solid-flag_LF_Qual_Results_Customer_2.pdf
    15862_S912XEP_TSMC11_FAB_QUAL_and_Cu_wire_QUAL_for_TSMC3-11_parts_in_FSL-KLM.pdf